SW-ALL
SW-PG-JA
SW-MG-400004022
OG-SW-S-208
A rapid curing, general purpose epoxy adhesive / encapsulant | |
It forms a clear, hard, rigid bond or coating in minutes | |
7 minute fixture time | |
100% reactive, no solvents | |
Good dielectric strength | |
Bonds metal, fabrics, ceramics, glass, wood and concrete (in combinations) | |
Good solvent resistance | |
Areas of Application: Cures fast for quick metal to metal bonding and repairs, Pots and encapsulates electronic components and assemblies, Seals against dust, dirt and combination, Fast curing, thin set, bonding above 5°C |
A rapid curing, general purpose epoxy adhesive / encapsulant | |
It forms a clear, hard, rigid bond or coating in minutes | |
7 minute fixture time | |
100% reactive, no solvents | |
Good dielectric strength | |
Bonds metal, fabrics, ceramics, glass, wood and concrete (in combinations) | |
Good solvent resistance | |
Areas of Application: Cures fast for quick metal to metal bonding and repairs, Pots and encapsulates electronic components and assemblies, Seals against dust, dirt and combination, Fast curing, thin set, bonding above 5°C |